Xiaomi Corp confirmed on Monday that it will unveil a 3nm Xuanjie O1 chip on Thursday, after over four years of intensive R&D efforts.

The move will position Xiaomi in direct competition with leading global chipmakers, with the new chip poised to power Xiaomi's latest smartphones.

ALSO READ: Grow with Xiaomi: Building a sustainable open ecosystem for apps, services and contents

Lei Jun, CEO and chairman of Xiaomi, said via a post on Sina Weibo that the company's cumulative investment in Xuanjie chip exceeded over 13.5 billion yuan ($1.9 billion) by the end of April 2025.

Xiaomi now has a 2,500-strong semiconductor R&D team driving innovation, enforcing its position among China's top three semiconductor design firms in both R&D spending and team scale, Lei said.

READ MORE: Chinese EV-makers expand globally, push for chip self-sufficiency

Lei also emphasized the significance of the achievement: "Reaching this milestone demanded unwavering commitment, courage, and substantial technical and financial resources. The Xuanjie O1 marks the beginning of our journey to redefine high-end semiconductor capabilities in the global market."